Fully automatic and manual modes can be switched
Intelligent feeding module, capable of switching between multiple peeling methods
Visual operating system
It can achieve the extraction of spacers before pasting and the addition of spacers after pasting
Applicable: EMI and CVL bonding in FPC empty board process
| Accuracy | ±0.1mm |
| Speed | 2 point：6-8s/pcs , 4 point：9-11s/pcs |
| FPC size | Max305mm*610mm |
| Material size | 50mm*100mm-260mm*400mm |
| Material thickness | 0.03mm-0.5mm |
| Material Positioning mode | 2-point or 4-point mark point recognition and positioning |
| FPC Positioninig mode | 2-point or 4-point mark point recognition and positioning |
| Feed mode of FPC | Sheet feed |
| Feed mode of CVL and EMI | Method 1. Roll feed -------3 inch roll core , Method 2. Stripped sheet material -- stack thickness: 80mm |
| Bonding mode | Aluminum glue sucker face is heated |
| Bonding pressure | There are 4 pressurized cylinders, with a maximum bonding force of 5KN, suitable for EMI that is difficult to stick tightly |
| Loading and unloading device | Automatic loading and unloading |
| FPC with spacer | allow |
| Half cut function | NO |
| Quantity of working platform | 1 |
| Quantity of bonding head | 1 |
| Working platform temperature | Room temperature: ~150℃ |
| Bonding head temperature | Room temperature: ~150℃ |
| Safety protection | Protective cover, safety sensor |
| Machine dimensions | L:2170mm;W:1570mm;H:2130mm |
| Machine weight | 2800Kg |
| Working power supply | 380V, three-phase five-wire system, 50HZ |
| Machine power | 10KW |
| Compressed air source | 0.5-0.7MPa |
| Air consumption | 300L/min |
| Platform adsorption | Blower |
| Operating system | Windows interface |
| Operating language | Chinese /English |
| Control interface | 17" monitor + keyboard mouse |
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sales@szbondtech.com
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